Company Info

eSOL CTO and Senior Executive VP/Head of Software Division Masaki Gondo to Participate in International IEEE Symposium (COOL Chips 25)

eSOL CTO and Senior Executive VP/Head of Software Division Masaki Gondo will take part in the COOL Chips 25 symposium on April 20-22, 2022 in Tokyo, Japan.

IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications.

Masaki will give a presentation about Software-Defined Architecture (SDA) in the embedded system industries and host “The future of Mission-critical mixed-criticality high-performance embedded systems" panel discussion on April 21.

About COOL Chips 25
Date April 20-22, 2022
Venue Takeda Hall, The University of Tokyo, Japan/online
Participation Prior registration is required
Official website https://www.coolchips.org/2022/


Panel discussion
Date April 21, 10:10-11:40
Title The future of Mission-critical, mixed-criticality high-performance embedded systems
Abstract Experts from different fields will discuss the future of Mission-critical, mixed-criticality high-performance embedded systems, expected in automotive and other vehicle systems, industrial devices, and other edge computing, as well as technological and business challenges in system software and hardware industries
Organizer and Moderator Masaki Gondo


Keynote Presentation
Date April 21, 15:10-16:00
Title Software-Defined Architecture and platforms - automotive and beyond
Abstract This presentation will be focused on the usage of “Software-Defined Architecture (SDA)” term in the embedded system industries, the background of SDA trends, and the design approach of next-generation software platforms, based on the example of AUTOSAR Adaptive
Presenter Masaki Gondo