eSOL to Take Part in the SOAFEE Seminar in Japan

Notice of Support and Maintenance Services Closure during the Golden Week Holidays

Announcement of eSOL's New Management Structure

eSOL Europe expands to support “Full Stack Engineering” strategy globally

eSOL TRINITY with Corellium agree to distribute Corellium Virtual Devices to Japanese market.

eSOL and Intron Technology Enter Business Partnership for Next-Generation SDVs in the Chinese Market

Notice of Changes in Company Board of Directors

Masaki Gondo, eSOL’s CTO and Senior Executive VP/Head of Software, to Attend the 6th Software Defined Vehicles Forum & AUTOSAR China Day 2025

eSOL to Take Part in embedded world 2025

eSOL Technology Forum 2024 Welcomes You in Tokyo in September! 

eSOL's Leading OS “eMCOS® POSIX” Now Supports Latest Arm Real-Time Automotive Processor, Demonstrating Continued Ecosystem Momentum

Masaki Gondo, eSOL’s CTO and Senior Executive VP/Head of Software Division, to Attend MPSoC 2024

eSOL Participates as Gold Sponsor in 15th AUTOSAR Open Conference

First Public Demonstration of eMCOS® Real-Time Operating System Running on the NXP GoldBox for Vehicle Networking Development Platform

Participation in the Arm Automotive Partner Ecosystem to accelerate SDV

eSOL to Take Part in EdgeTech+ 2023

eSOL to Take Part in Arm Tech Symposia 2023

New NXP S32G support from eSOL enhances eMCOS® SDK

eSOL joins SOAFEE special interest group to improve software development for vehicles

New Software-Factory-Ready eMCOS® SDK by eSOL

Notice of the 48th Annual General Meeting of Shareholder

New Software Development Kits Supporting Open Industrial Network CC-LINK IE TSN to be Released Next Spring

eSOL RTOS Adopted by Janome Corporation for Its Top-of-the-Line Computerized Sewing Machine With HD Embroidery

New Partner Solution Allows eSOL Customers to Harness the Full Programming Power of Rust

Communication Gateway Aggregates ECUs for Automotive SOA Architectures

eSOL to Take Part in Embedded World 2022

eSOL CTO and Senior Executive VP/Head of Software Division Masaki Gondo Will Be Participating in International IEEE Symposium (COOL Chips 25)

Notice of the 47th Annual General Meeting of Shareholder

eSOL Corporate profile 2022

eSOL Fourth-quarter-report 2021