eSOL CTO and Senior Executive VP/Head of Software Division Masaki Gondo Will Be Participating in International IEEE Symposium (COOL Chips 25)
eSOL CTO and Senior Executive VP/Head of Software Division Masaki Gondo will take part in the COOL Chips 25 symposium on April 20-22, 2022 in Tokyo, Japan.
IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications.
Masaki will give a presentation about Software-Defined Architecture (SDA) in the embedded system industries and host “The future of Mission-critical mixed-criticality high-performance embedded systems" panel discussion on April 21.
About COOL Chips 25
|Date||April 20-22, 2022|
|Venue||Takeda Hall, The University of Tokyo, Japan/online|
|Participation||Prior registration is required|
|Date||April 21, 10:10-11:40
|Title||The future of Mission-critical, mixed-criticality high-performance embedded systems|
|Abstract||Experts from different fields will discuss the future of Mission-critical, mixed-criticality high-performance embedded systems, expected in automotive and other vehicle systems, industrial devices, and other edge computing, as well as technological and business challenges in system software and hardware industries|
|Organizer and Moderator||Masaki Gondo
|Date||April 21, 15:10-16:00
|Title||Software-Defined Architecture and platforms - automotive and beyond|
|Abstract||This presentation will be focused on the usage of “Software-Defined Architecture (SDA)” term in the embedded system industries, the background of SDA trends, and the design approach of next-generation software platforms, based on the example of AUTOSAR Adaptive|